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AS1117
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
V DD to GND
Min
-0.3
Max
7
Units
V
Notes
Input Voltage Range
Current
All other pins to GND
DIG0:DIG7 Sink Current
SEGA:SEGG, SEGDP
-0.3
7 or
V DD + 0.3
500
100
V
mA
mA
ESD
Humidity
Digital outputs
All other pins
5
1
85
%
kV
Non-condensing
Norm: MIL 833 E method 3015
Latch-Up Immunity
Thermal Resistance Θ JA
±100
30.5
mA
oC/W
EIA/JESD78
on PCB
Ambient Temperature
Storage Temperature
-40
-55
+85
150
oC
oC
The reflow peak soldering
temperature (body temperature)
specified is in accordance with IPC/
JEDEC J-STD-020D “Moisture/
Package Body Temperature
+260
oC
Reflow Sensitivity Classification for
Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
www.austriamicrosystems.com/LED-Driver-ICs/AS1117
Revision 1.00
3 - 23
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